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U.S. SIA and India's IESA Plan to Form Working Group to Enhance Cooperation in Global Semiconductor Ecosystem

Update time : 2023-02-04 10:46:38

Recently, the Semiconductor Industry Association (SIA) and the Indian Electronics and Semiconductor Association (IESA) jointly announced plans to establish a private sector working group to strengthen cooperation between the two countries in the global semiconductor ecosystem.

According to an official SIA release, the specific objectives of the working group include developing a "readiness assessment" of India's semiconductor ecosystem; bringing together industry, government and academic stakeholders to identify near-term industry opportunities and facilitate long-term strategic development of a complementary semiconductor ecosystem; and providing advice on enhancing India's role in the global semiconductor value chain, including chip manufacturing. including chip manufacturing); and make recommendations on opportunities and challenges to enhance India's role in the global semiconductor value chain (including chip manufacturing); and identify and facilitate workforce development and exchange opportunities to benefit both countries.
India is already a major hub for semiconductor research, chip design and device engineering, but its future potential is even greater, said John Neuffer, SIA president and CEO. The working group will help identify practical ways to unlock this potential by strengthening cooperation between the U.S. and India in the global chip ecosystem.
It will be an important platform to bring together global resources to identify viable programs to support India in increasing its presence in the global chip industry, and then enable global collaboration to execute programs across all segments of the design and manufacturing supply chain, as well as develop semiconductor talent for the world, said Krishna Moorthy, president and CEO of IESA.
According to the agreement, the two parties will set up a joint venture in India with the main objective of investing in the production of semiconductor products, with Vedanta and Hon Hai contributing 60% and 40% respectively to the new company, with Vedanta Resources becoming the majority shareholder of the joint venture and with an Indian as the chairman of the joint venture. In addition, the two sides plan that the plant will start operation in 2025/2026 to produce 12-inch chips based on the 28nm process, which is widely used in home appliances, automobiles and cell phones.

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