Industry News

Using TSMC's 3nm Process, Marvell Launched the World's First 3nm Chip

Update time : 2023-05-04 11:28:08

Recently, U.S. chip company Marvell, has finally officially released the world's first 3nm chip, a data center chip built on TSMC's 3nm process.
According to Marvell, its TSMC 3nm-based chip can be used to design a comprehensive silicon IP portfolio of chips that will fundamentally improve the bandwidth, performance and power efficiency of next-generation data infrastructures. The division is pioneering the 112G XSR SerDes (serializer/deserializer), Long Reach SerDes, PCIe Gen 6 PHY / CXL 3.0 SerDes and 240 Tbps parallel chip-to-chip interconnect in the 3nm node for managing data flows in the data infrastructure.
According to Marvell, SerDes and parallel interconnects act as high-speed channels in the chip to exchange data between chips or silicon components within the Chiplet, and together with 2.5D and 3D packaging, these technologies will eliminate system-level bottlenecks to advance complex semiconductor designs. .
The new parallel chip-to-chip interconnect enables aggregated data transfers of up to 240Tbps, 45% faster than available alternatives for multi-chip package applications. In other words, this new solution interconnects the equivalent of downloading 10,000 HD movies per second, albeit at distances of a few millimeters or less.
Marvell has integrated its SerDes and interconnect technologies into its flagship silicon solutions, including Teralynx switches, PAM4 and coherent DSPs, Alaska Ethernet physical layer (PHY) devices, OCTEON processors, Bravera storage controllers, Brightlane automotive Ethernet chipsets and custom ASICs. while the move to 3nm process enables engineers to reduce the cost and power consumption of chips and computing systems while maintaining signal integrity and performance.

Previous : ON Semiconductor's first quarter silicon carbide revenue up nearly 100 percent sequentially

Next : clearly needs to improve its AI development tools and processes.

DS1746-70+ Analog Devices / Maxim Integrated-Real Time Clocks ICS

Mar .28.2025

The DS1746-70+ is a highly advanced and fully functional real-time clock/calendar and nonvolatile static RAM. With its year-2000-compliant design, this product ensures accurate timekeeping and data storage without any risk of Y2K-related issues. The byte-

MBRS540T3G by onsemi Schottky Rectifiers

Mar .26.2025

Onsemi MBRS540T3G is a surface - mounted Schottky power rectifier. It features a compact J - bent pin package, ideal for space - saving, high - density PCB assembly. With a stable oxide - passivated chip, it ensures reliability and low leakage. It's RoHS

Microchip Technology PIC16F15323-I/JQ - 8-bit Microcontrollers

Mar .24.2025

The Microchip PIC16F15323-I/JQ is an 8-bit microcontroller with a CPU speed of 32MHz. It is part of the PIC16 family of microcontrollers, specifically the PIC16F153Xx series. This particular model has a program memory size of 3.5KB and a RAM memory size o

PIC16F15323-I/ST Microchip Technology-8 Bit MCU

Mar .21.2025

One of the key features of the PIC16F15323-I/ST is its support for PWMs, multiple communication protocols, a temperature sensor, and innovative memory management features like Memory Access Partition (MAP) and Device Information Area (DIA). These capabili

About Us

About Us What we do Quality People

Products

CHIP/IC Active devices Passive device Components OTHER

China electronic components supplier----Wah Luen Shing Electronic.----www.wlschip.com

Leave a message