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Qualcomm promotes 5G innovation to empower the automotive industry, accelerating the arrival of the era of intelligent connected vehicles
Jun 12, 2023
06-12
2023
More and more industries are actively promoting the mutual promotion and integrated development of 5G innovative applications and this industry, and the automotive industry is one of them. According to statistical information, in the first 11 months of 20
Micron announces high-capacity 96GB DDR5-4800 RDIMM memory
Jun 10, 2023
06-10
2023
June 7 news, memory manufacturers in the first quarter of this year launched a single 48GB of non-binary memory, dual-slot can achieve 96GB, four memory slots fully inserted to achieve 192GB of memory capacity.
Sanan and STMicroelectronics Invest in 200mm SiC Plant in Chongqing, China
Jun 10, 2023
06-10
2023
The day before yesterday, STMicroelectronics announced on its official website that it will set up a 200mm silicon carbide device manufacturing joint venture division with Sanan Optoelectronics in Chongqing, China, which is expected to go into production
TSMC Advanced Packaging and Testing Plant 6 officially opened: based on the 3DFabric technology platform, it can process more than 1 million 12-inch w
Jun 09, 2023
06-09
2023
On June 8, TSMC, a leading foundry manufacturer, announced the official opening of its sixth advanced packaging and testing facility, becoming TSMC's first 3DFabric integration of front-to-back processes and testing services. Automated advanced packaging
Sources revealed that TSMC urgently ordered packaging equipment to meet Nvidia's AI chip needs
Jun 09, 2023
06-09
2023
On June 7, according to foreign media reports, the increase in demand for artificial intelligence applications such as ChatGPT has boosted demand for high-performance GPUs such as Nvidia H100 and A100, which has also prompted them to increase orders at TS
IAR Embedded Workbench for Arm Version 9.40 Enhances Code Security with PACBTI Integration
Jun 09, 2023
06-09
2023
June 7, 2023 - IAR, a global leader in embedded software and services, has released the popular IAR Embedded Workbench for Arm v9.40. The latest release introduces enhancements for code security: the addition of a pointer verification and branch target id
Ahmers Osram introduces new infrared VCSEL emitters for in-cabin sensing, with new reliable built-in human eye safety features
Jun 08, 2023
06-08
2023
Ahmers Osram, a leading global provider of optical solutions, today announced the launch of the TARA2000-AUT-SAFE family of vertical cavity surface emitting lasers (VCSELs), enhancing its portfolio of infrared laser modules for in-cabin sensing in automob
Farewell to Tiger Lake, Intel discontinues 11th generation mobile CPUs and 500 series chipsets
Jun 08, 2023
06-08
2023
Intel has announced that it is discontinuing almost all of its 11th generation Tiger Lake processors, in the midst of the launch of 13th generation Raptor Lake and the upcoming launch of 14th generation Meteor Lake.
Intel Breaks Through Interconnect Bottlenecks with PowerVia Back Side Power Technology to Meet New Era of Computing Demand
Jun 08, 2023
06-08
2023
Intel is the first to implement backside power technology on a product-level chip, enabling over 90 percent cell utilization while also demonstrating industry-leading performance in other dimensions.
TSMC: It is evaluating the second chip factory in Japan, which is still mainly mature in Kumamoto
Jun 07, 2023
06-07
2023
On June 6, it was reported that TSMC has currently set up a factory in Kumamoto, Japan, and is expected to produce it in 2024. Chairman Liu Deyin said that it is currently evaluating the establishment of a second factory, and the location of the factory w
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