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40 TSMC expects to introduce Nvidia AI acceleration technology cuLitho into a 2nm pilot run in June

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Update time : 2023-03-24 13:57:54
        Nvidia has worked hand in hand with TSMC, ASML and Synopsys. After four years of development, Nvidia has finally completed cuLitho, a new AI acceleration technology. According to reports, CuLitho can increase the computing scale of next-generation chips by more than 40 times, making it possible to manufacture 2nm and more advanced chips. CuLitho is a library of arithmetic lithography functions that will shorten the photomask time of advanced process chips, increase yields, and significantly reduce the energy consumption required for wafer fabrication.
 
 
        According to Taiwan United Daily News, TSMC will certify cuLitho's production qualification in June this year and complete the 2nm pilot run, which will be used to improve the yield of the 2nm process and shorten the mass production time. According to reports, the new NVIDIA cuLitho software library for computational lithography has been integrated by TSMC and Synopsys into the software, manufacturing processes and systems of its latest generation NVIDIA Hopper architecture GPUs, while equipment manufacturer ASML is working closely with NVIDIA on GPUs and cuLitho, and plans to integrate GPU support into all of its computational lithography software products.
        "The chip industry is the foundation of almost every other industry in the world, and with lithography reaching its physical limits, NVIDIA has launched cuLitho and partnered with our partners TSMC, ASML and Synopsys to enable fabs to increase production, reduce carbon footprint and lay the foundation for 2nm and beyond," Huang said. Nvidia says cuLitho can deliver a 40-fold performance leap over current photolithography technology — the process of etching patterns on silicon wafers — and dramatically accelerate the kind of large-scale computing that "consumes tens of billions of CPU hours per year."
        According to previous reports, TSMC's construction of the Fab 20 ultra-large wafer fab in Zhuke Baoshan Phase II will be used as a 2nm production base and become a 2nm town. The first phase of Fab20 is expected to start piloting in 2024. Mass production will begin in 2025, and the second phase is currently under construction. It is expected that it will gradually enter the risky pilot run and mass production after the first phase of mass production. According to the cooperation plan of the four major semiconductor manufacturers, the advancement of this technology will allow the use of finer circuits than today's chips, while speeding up the IPO time and improving the energy efficiency of the large-scale data centers that operate a ll day to drive the process.
        TSMC President Wei Zhejia said cuLitho team has made significant progress in accelerating the operation of calculus-based lithography technology by transferring time-consuming tasks to GPUs. This development provides TSMC with the opportunity to deploy lithography technology solutions such as reverse lithography technology and deep learning on a larger scale in chip manufacturing, and provides an important contribution to the continued development of semiconductor miniaturization.
 

 
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