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From the latest IDM production capacity and expansion of semiconductor trends

Update time : 2022-09-21 15:50:48

IDM is vertical integrated manufacturing, refers to the design, manufacturing, packaging and testing, and sales of its own brand chips are all vertically integrated semiconductor companies. Because it has the ability of the other two modes at the same time, IDM mode enterprises are the chip enterprises with the highest technological threshold and the largest investment in the global chip industry chain.

The top 10 IDM vendors have a combined capacity of 13.16 million wafers/month, with storage accounting for half of the global wafer capacity. As one of the main supply sources of global wafer manufacturing, IDM manufacturers are of great importance. According to data from Knometa Researc, by the end of 2021, the total production capacity of IC wafers in the world is 21.6 million/month, of which the top five companies (Samsung, TSMC, Micguang, SK Hynix, Kaixia/Western Digital) account for 57%, reaching 12.21 million/month, an increase of 10% over the previous year. That growth rate is one percentage point higher than the industry's total capacity.
In terms of specific data, Samsung holds the top spot with an average monthly production of 4.05 million wafers, accounting for 19% of the global market and 44% more capacity than TSMC, the second largest. In addition to making chips for some designers, Samsung has a number of wafer-related products that have been a major driver of its market share gains. Although memory chips account for half of the global wafer production capacity due to their large demand, manufacturers in logic, simulation, power and other fields still occupy a place in the global top ten IDM manufacturers' production capacity ranking.
In terms of analog chips, Texas Instruments, stmicroelectronics and Yadno currently rank first in capacity. As the world's absolute leader in analog chips, TI's current production capacity of 850,000 chips per month is twice that of the second analog chip company, Adeno. It is worth noting that while STMICRO's current production capacity is as high as 820,000 chips/month, this is largely the result of the addition of silicon carbide and gallium nitride for analog chips and power chips.
In terms of power devices, because they are mainly applied in the fields with high requirements such as automobile and industry, the verification cycle is long, and the production expansion is difficult, which leads to the relatively small capacity of global power IDM manufacturers. Among them, Anson Mae and Infineon are the representatives, and the current production capacity of both of them is about 250,000 tablets/month.
According to data released by IC Insights, global semiconductor industry capital expenditure grew by 10% in 2020, reversing the decline in 2019. While in 2021, capital expenditure expanded further on the basis of 2020, rising 36 percent year-on-year to 153.9 billion yuan. IC Insights forecasts that global capex will increase by 24% to an all-time high of $190.4 billion in 2022. If the forecast is met in 2022, it will be the first time since 1993-1995 that the semiconductor industry has recorded three consecutive years of double-digit spending growth.
In the current weak consumer electronics market, the delay in the expansion process has offset some of the oversupply concerns about 2023 capacity. However, the shortage of some parts, which are still in tight supply, is likely to be prolonged again, depending on the diversified layout of each fab for each end application and each product process. To balance the uneven distribution of material resources and the situation.
It is worth emphasizing that Intel, as the IDM leader in logic chips, spent $27 billion in capital expenditures in 2022, ranking it first among the top 10 IDM vendors. Intel internally plans to expand its fab capacity by 30 percent over the next five years by 2026, including adding capacity in Ireland, Israel and the United States from 2023 to 2024, in an effort to overtake TSMC. The sharp drop in consumer demand has eased the global chip shortage that has lasted for two years, and the global semiconductor market has shifted from a comprehensive deficit to a structural deficit. From the perspective of the expansion cycle, the capacity of this wave of fab expansion is expected to continue to be released in the next three years or so, and it is expected that by 2024-2025, the mismatch between global chip supply and demand will be significantly alleviated.
Although IDM plants are less competitive in logic chips than chip design plants, the situation is reversed in analog and power chips. In terms of analog and power semiconductors, IDM manufacturers have established a very high threshold for technology and business. In the long run, the high threshold ensures that IDM plants will become core competencies in automotive and industrial non-consumer applications, which may be why IDM plants are able to aggressively expand production during the cool-off period in the semiconductor market.

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