The high-performance CIPOS™ Maxi transfer-molded package IPM IM12BxxxC1 series is based on the new 1200V TRENCHSTOP™ IGBT7 and the fast diode Emcon 7 technologies. Thanks to the adoption of the latest micro-trench-designed chips, this product features outstanding control capabilities and performance, which significantly reduces losses, improves efficiency, and increases power density. The product portfolio includes three new products with current ratings of 10A, 15A, and 20A respectively.
The high-performance CIPOS™ Maxi transfer-molded package IPM IM12BxxxC1 series is based on the new 1200V TRENCHSTOP™ IGBT7 and the fast diode Emcon 7 technologies. Due to the utilization of the latest micro-trench-designed chips, this product possesses excellent control abilities and performance, which greatly decreases losses, enhances efficiency, and boosts power density. The product combination encompasses three new items with current ratings of 10A, 15A, and 20A.
This IPM is the smallest and most compact package in the 1200V class, with a rated power exceeding 4kW. It offers outstanding power density, reliability, and performance. It also has excellent protection functions, such as undervoltage protection, low-voltage protection, voltage locking for all channels, all switches turned off during protection, prevention of cross-conduction, overcurrent protection, and temperature monitoring.
Product Models
IM12B10CC1 (10A 1200V, packaged in PG-MDIP-24)
IM12B15CC1 (15A 1200V, packaged in PG-MDIP-24)
IM12B20EC1 (20A 1200V, packaged in PG-MDIP-24)
Product Features
Fully isolated dual in-line plastic package module with DCB (Direct Copper Bonding).
1200V TRENCHSTOP™ IGBT7.
Robust 1200V SOI (Silicon-on-Insulator) gate driver technology.
Integrated bootstrap power supply function.
Overcurrent shutdown.
Undervoltage lockout for all channels.
All six switches are turned off during protection.
Prevention of cross-conduction.
When VBS = 15V, the negative VS potential allowed for signal transmission can be up to 11V.
Independent low-side emitter pins.
Application Value
The smallest package size among 1200V IPMs, with high power density and excellent performance.
The robust gate driver technology provides outstanding protection.
High efficiency.
High-speed switching, with a modulation frequency of up to 20kHz.
Suitable for high-speed switching applications with lower power consumption.
Simplifies design and manufacturing.
Block Diagram
Application Areas
Fans.
Water pumps.
HVAC (Heating, Ventilation, and Air Conditioning) outdoor fans.
Low-power motor drivers.
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