Industry News

Renesas Electronics announces partnership with AMD to demonstrate complete RF and digital front-end designs for 5G active antenna systems

Update time : 2023-02-22 13:40:34

Renesas Electronics, a global semiconductor solutions provider, today announced that it will work with AMD to demonstrate a complete RF front-end solution for 5G active antenna system (AAS) radios. The new RF front-end is paired with the field-proven AMD Zynq UltraScale+ RFSoC digital front-end OpenRAN radio (O-RU) reference design, which includes RF switches, low-noise amplifiers, and pre-drivers, providing a complete solution to meet the growing market demand for mobile network infrastructure. The reference platform will be demonstrated at the AMD booth at Mobile World Congress in Barcelona, Spain, from February 27 to March 2.

The new 5G design platform integrates all the essential RF and digital front-end hardware for base stations operating in the Open Radio Access Network (O-RAN) ecosystem, including a highly isolated multi-throw DPD (digital pre-distortion) switch, a high gain and linearity pre-driver in a compact package, an integrated switch, and a low noise amplifier (LNA) with input signal coupling. This complete RF front-end platform is designed to efficiently process and transmit data to wireless networks at optimised power levels. It is also integrated with the AMD RFSoC DFE ZCU670 evaluation kit for rapid prototyping and rapid development of wireless networking systems. This platform delivers superior RF performance while minimising DPD resources for TX channel linearisation, improving radio efficiency and ultimately reducing operational costs for wireless network providers.
This RF front-end solution is the latest 5G solution jointly developed by Renesas and AMD. Previously, the two companies collaborated on a high performance RF timing solution for 5G Next Generation Radio (5G NR), which incorporates Renesas' IEEE1588-enabled system synchroniser as part of the DFE ZCU670 evaluation kit.
Renesas is proud to join forces with AMD once again to showcase our latest RF technology at the upcoming Mobile World Congress," said Naveen Yanduru, Vice President, RF Communications, Industrial & Communications Division, Renesas Electronics. With our turnkey hardware solution, developers of 5G RF wireless infrastructure systems will be able to reduce development time and costs. We believe that this solution will set a new standard for RF performance and efficiency in the wireless communications market."
The ZCU670 evaluation board on-board RFMC expansion connector enables our users to quickly prototype and evaluate complete RF line designs for their radio solutions," said Brendan Farley, corporate vice president of wireless engineering at AMD. To demonstrate this, we have once again worked with Renesas to develop an optimized RF front-end reference design for the N78 band. As the OpenRAN 5G radio (O-RU) market continues to grow, these reference designs will help shorten the time to market for our mutual users with a proven solution."

Previous : Samsung Electronics to supply BMW with new automotive SoC "Exynos Auto V" with built-in NPU, sources say

Next : STMicroelectronics Announces Flyback Controller with Integrated Advanced Features to Enhance LED Lighting Performance

How many chips does a car need?

Sep .19.2024

Automotive chips can be divided into four types according to their functions: control (MCU and AI chips), power, sensors, and others (such as memory). The market is monopolized by international giants. The automotive chips people often talk about refer to

Position and Function of Main Automotive Sensors

Sep .18.2024

The function of the air flow sensor is to convert the amount of air inhaled into the engine into an electrical signal and provide it to the electronic control unit (ECU). It is the main basis for determining the basic fuel injection volume. Vane type: The

Chip: The increasingly intelligent electronic brain

Sep .14.2024

In this era of rapid technological development, we often marvel at how mobile phones can run various application software smoothly, how online classes can be free of lag and achieve zero latency, and how the functions of electronic devices are becoming mo

LDA100 Optocoupler: Outstanding Performance, Wide Applications

Sep .13.2024

In terms of characteristics, LDA100 is outstanding. It offers AC and DC input versions for optional selection, enabling it to work stably in different power supply environments. The small 6-pin DIP package not only saves space but also facilitates install

About Us

About Us What we do Quality People

Products

CHIP/IC Active devices Passive device Components OTHER

China electronic components supplier----Wah Luen Shing Electronic.----www.wlschip.com

Leave a message