Industry News

Samsung Electro-Mechanics develops FCBGA semiconductor substrate for autonomous driving

Update time : 2023-03-02 15:09:49

Samsung Electro-Mechanics has announced that it has developed an automotive semiconductor substrate (FCBGA, Flip Chip-Ball Grid Array) for advanced driver assistance systems (ADAS), expanding its lineup of high-end automotive semiconductor substrates, which Samsung Electro-Mechanics plans to supply to customers worldwide.

Samsung said that the newly developed FCBGA is suitable for high-performance autonomous driving systems and is one of the most technologically advanced products in automotive electronics.
According to the report, the newly developed substrate, which has a 20 per cent reduction in circuit width and pitch, also achieves more than 10,000 bumps in a limited space, allowing for the design of higher density semiconductors, which will improve the performance and efficiency of chips based on the substrate. It also addresses reliability issues, including increased flexural strength, to cope with multi-chip packages where multiple chips are mounted on a single substrate at the same time.
The FC-BGA package offers better electrical characteristics, significantly increased pin density, reduced interference, improved thermal performance and reduced package size to meet the needs of high-end and high-performance products. The chip bump is one of the key components of the FC interconnect structure and has three main functions: forming the electrical connection between the chip and the substrate, forming the structural connection between the chip and the substrate, and providing a means of heat dissipation for the chip.
Samsung Electro-Mechanics said the new product is now certified to the AEC-Q100 standard for reliability testing of automotive electronic components and can be used in a variety of applications, from body and chassis to infotainment and autonomous driving.

Previous : Vishay Introduces Upgraded Infrared Receivers to Reduce Supply Current and Improve Reliability Against ESD and Direct Sunlight

Next : The Global Mobile Communications Equipment Giant will Lay off 8,500 Employees

How many chips does a car need?

Sep .19.2024

Automotive chips can be divided into four types according to their functions: control (MCU and AI chips), power, sensors, and others (such as memory). The market is monopolized by international giants. The automotive chips people often talk about refer to

Position and Function of Main Automotive Sensors

Sep .18.2024

The function of the air flow sensor is to convert the amount of air inhaled into the engine into an electrical signal and provide it to the electronic control unit (ECU). It is the main basis for determining the basic fuel injection volume. Vane type: The

Chip: The increasingly intelligent electronic brain

Sep .14.2024

In this era of rapid technological development, we often marvel at how mobile phones can run various application software smoothly, how online classes can be free of lag and achieve zero latency, and how the functions of electronic devices are becoming mo

LDA100 Optocoupler: Outstanding Performance, Wide Applications

Sep .13.2024

In terms of characteristics, LDA100 is outstanding. It offers AC and DC input versions for optional selection, enabling it to work stably in different power supply environments. The small 6-pin DIP package not only saves space but also facilitates install

About Us

About Us What we do Quality People

Products

CHIP/IC Active devices Passive device Components OTHER

China electronic components supplier----Wah Luen Shing Electronic.----www.wlschip.com

Leave a message