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The first in the industry! Micron Announces 232-Layer 3D NAND Flash

Update time : 2022-05-16 14:42:07

Micron on Thursday announced the industry's first 3D NAND memory with 232 layers. The company plans to use its new 232-layer 3D NAND products in a variety of products, including solid-state drives, and plans to ramp up production of such chips from time to time in late 2022.
Micron's 232-layer 3D NAND devices use a 3D TLC architecture and have a raw capacity of 1Tb (128GB). The chip is based on Micron's CMOS Under Array (CuA) architecture and uses NAND string stacking technology to build two 3D NAND arrays on top of each other.

The CuA design combined with the 232-layer NAND chips will significantly reduce the die size of Micron's 1Tb 3D TLC NAND memory, which will lower production costs and allow Micron to more aggressively price devices with these chips, or add more profit.
Micron didn't announce the I/O speed or plane count for its new 232L 3D TLC NAND IC, but hinted that the new memory will offer higher performance than existing 3D NAND devices, which is especially useful for next-generation SSDs, especially those with PCIe 5.0 interfaces. it works.
Speaking of SSDs, Scott DeBoer, executive vice president of technology and products at Micron, noted that the company works closely with developers of in-house and third-party NAND controllers (used in SSDs and other NAND-based storage devices) to enable implementation of new types of memory. Proper support (. Among other benefits of the 232-layer 3D TLC NAND node, Micron mentioned lower power consumption than previous-generation nodes, which will be given Micron's ongoing focus on mobile applications and relationships with related device manufacturers) is another advantage.

Considering that Micron will start producing 232-layer 3D TLC NAND devices later in 2022, we can expect SSDs powered by the new memory to hit the market sometime in 2023.

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