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TSMC raises CoWoS capacity target as super rush orders from NVIDIA and others increase, sources say

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Update time : 2024-01-31 11:22:00
        TSMC's expansion strategy for CoWoS advanced package manufacturing has gained momentum and the company has raised its capacity targets, according to sources at the semiconductor equipment maker. Customers such as NVIDIA and AMD are increasingly demanding super hot runs.
 
 
        For TSMC's largest CoWoS customer, NVIDIA, the NVIDIA H100 chip delivery cycle has been shortened. However, sources noted that lead times are still as long as 10 months, indicating that demand for AI-related chips is still quite high.
        TSMC has set a goal of increasing its advanced packaging capabilities. By the end of 2024, TSMC's CoWoS packaging capacity will reach 32,000 wafers per month, and by the end of 2025 it will increase to 44,000 wafers per month, previous reports said, citing industry sources. 
        On January 18, Wei Zhejia pointed out at the TSMC conference on advanced packaging issues, AI chip advanced packaging demand continues to be strong, the current situation is still capacity can not cope with the strong demand of customers, the situation of oversupply may continue until 2025. TSMC continues to expand advanced packaging capacity this year, advanced packaging capacity planning this year doubled, is still in short supply, and is expected to continue to expand capacity in 2025. 
        Wei Zhejia pointed out that TSMC layout of advanced packaging technology has been more than 10 years, including CoWoS (Chip on Wafer on Substrate), 3D IC, SoIC and other advanced packaging, the compound annual growth rate in the next few years can be at least more than 50%. TSMC continues to research and develop the next generation of CoWoS advanced packaging technology," said Mr. Wei.
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