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Qualcomm confirms development of XR devices with Samsung and LG, new generation of XR-specific chips to be released in early 2024
Nov 21, 2023
11-21
2023
According to Korean media ET News, Qualcomm confirmed cooperation with Samsung and LG to develop XR devices. Among other things, both Samsung and LG are building XR headsets based on Qualcomm chips. The report notes that "Korea's representative electronic
SK Hynix Fully Promotes Commercialization of World's Highest Rate LPDDR5T DRAMs
Nov 21, 2023
11-21
2023
SEOUL, South Korea, November 13, 2023 - SK Hynix (or 'the Company', https://www.skhynix.com) announced on November 13 that the Company is officially supplying customers with LPDDR5T (Low Power Double Data Rate 5 Turbo) ) 16GB (Gigabit) capacity kit produc
Germany approved Bosch, Infineon and NXP shares in TSMC chip plant
Nov 20, 2023
11-20
2023
According to reports, the German Enterprise Joint Administration (German cartel office) said in a statement on November 7, has approved Bosch, Infineon and NXP to participate in TSMC's new semiconductor plant in Dresden, Germany (Dresden).
MinebeaMitsumi to Acquire Hitachi's Company
Nov 20, 2023
11-20
2023
On November 2, MinebeaMitsumi announced that it will acquire Hitachi Power Semiconductor Device (HPSD), a power semiconductor business company under Hitachi, to strengthen its power semiconductor business.
Samsung, LG, Qualcomm will join forces to enter the XR market, cooperating to develop devices based on next-generation chips
Nov 18, 2023
11-18
2023
October 29 news, according to Korean media etnews reported today, Samsung and LG has been confirmed to be developing XR devices based on Qualcomm chips. Qualcomm Technologies vice president and general manager of the XR sector, Division Hongguo (Hugo Swar
Infineon Introduces EPR Electronically Marked Cable Assembly Controller with Up to 54 V Overvoltage Protection for USB-C Passive Cables
Nov 18, 2023
11-18
2023
USB-C is rapidly gaining popularity in the industrial sector thanks to its ultra-thin design, user-friendly universal connector experience, and versatility with support for multiple data protocols such as USB4, Thunderbolt and HDMI. In addition, USB-C can
Qualcomm: there are currently more than 3 billion devices around the world equipped with Qualcomm Snapdragon chip
Nov 17, 2023
11-17
2023
According to foreign media reports, Qualcomm revealed in today's keynote speech, there are currently more than 3 billion devices around the world equipped with Qualcomm Snapdragon chips. Qualcomm released two new chips, a Snapdragon 8 Gen 3 for high-end A
TSMC's Advanced Packaging Customers Chase Orders, Next Year's Monthly Capacity to Rise 120%
Nov 17, 2023
11-17
2023
According to Taiwan Economic Daily, demand for TSMC's CoWoS advanced packaging has exploded, and in addition to NVIDIA's confirmed order expansion in October, heavyweight customers such as Apple, AMD, Broadcom, Marvell and others have also been pursuing o
MediaTek Launched Tiangui 9300 Flagship 5G Generative AI Mobile Chip, Ushering in the Era of All-Big-Core Computing
Nov 16, 2023
11-16
2023
Yesterday, MediaTek announced the Tenguet 9300 flagship 5G generative AI mobile chip, which, with its innovative all-big-core architectural design, provides far superior high-intelligence, high-performance, high-energy-efficiency, and low-power-consumptio
Russia: 350nm Lithography to be Built by 2024
Nov 16, 2023
11-16
2023
According to Russian media reports, Russia itself is developing lithography for chip production. In a media interview, its Deputy Minister of Industry and Trade Vasily Shpak noted that production of 350-nanometer lithography will begin in 2024, and lithog
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