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PCB Industry in Recession in 2023, IC Carrier Board Growth First Down Then Up

Update time : 2023-04-14 11:16:09

According to research firm Prismark estimates that the global PCB output value of $78.367 billion in 2023, down 4.13% from $81.741 billion in 2022, but will resume year-on-year growth from 2024, with an average annual compound growth rate of 3.8% from 2023 to 2027.
As for product line categories, the PCB industry in 2023, including RPCB multilayer boards, flexible boards + modules, HDI, IC carrier boards, the four major product line output value will decline across the board. Among them: RPCB multilayer output value ranked first, reaching $37.34 billion, a decline of 3.57% from 2022; IC carrier board output value of $16.073 billion, a decline of 7.71% from 2022, the largest decline; flexible board + module output value of $13.427 billion, a decline of 3% from the previous year; HDI output value of $ 11.528 billion, a decline of 2% from the previous year.
Despite the recession in 2023, the market is generally expected to stabilize in the second half of 2023 or 2024, and demand will gradually recover, Prismark estimates also show that the whole line will resume positive growth from 2024, and the average annual compound growth rate of the four major product lines from 2023 to 2027 is 3.1%, 3.5%, 4.4% and 5.1%, respectively.
It is not difficult to find that IC carrier board as a key substrate for advanced packaging of integrated circuits, with potential growth space.
IC carrier board is developed on the basis of PCB board related technology, used to establish the signal connection between IC and PCB, in addition to play a role in protecting the circuit, fixing the line and dissipating waste heat. It has the characteristics of high density, high precision, miniaturization and thinness: in the field of high-level packaging, IC carrier board has replaced the traditional lead frame and become an indispensable part of the chip package, not only to provide support, heat dissipation and protection for the chip; at the same time to provide electronic connection between the chip and the PCB motherboard, playing a "top-down" role. The role of
According to analysis, the IC carrier board industry due to the past few years of rapid growth, but this year the demand is not good, resulting in a more significant decline this year. With the market demand expected to revive in 2024, IC carrier board or usher in new opportunities.
The market pattern of IC carrier board was first led by Japanese manufacturers, and then the capacity followed the semiconductor industry chain part of the shift to Taiwan and South Korea. In recent years, by the impact of South Korea and China and Taiwan manufacturers, Japanese companies to withdraw from the low-end market, to FC BGA, FC CSP and other high-end packaging substrates. At present, the top three IC carrier board companies for China Taiwan's Xinxing Electronics, Ibiden, Samsung Electromechanical, respectively, occupy 15%, 11%, 10% of the market share.

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