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Intel to abandon TowerSEMI acquisition
Aug 18, 2023
08-18
2023
Intel is expected to abandon its plan to buy Israeli foundry chipmaker TowerSEMI for $5.4 billion, as the clock ticks down to get regulatory approval.
Samsung Plans to Make BSPDN Back Power Technology Available for 1.4nm Processes by 2027
Aug 17, 2023
08-17
2023
Jung Ki-tae Jung, Chief Technology Officer of Samsung Electronics' Foundry Division, announced at a recent forum that "we plan to apply BSPDN to the 1.4 nm process in 2027".
LG Electronics Selects Valens VA7000 Chipset for its Next Generation Camera System Program
Aug 17, 2023
08-17
2023
Valens Semiconductor (NYSE: VLN, hereinafter referred to as Valens), a leading provider of high-performance connectivity solutions, announced that LG Electronics' Automotive Component Solutions division has chosen to deploy Valens' VA7000 MIPI A-PHY chips
Samsung Electronics Sold Part of ASML Stake: Getting about 3 Trillion Won
Aug 17, 2023
08-17
2023
Samsung Electronics has decided to sell a portion of its stake in Dutch semiconductor equipment maker ASML after holding it for seven years, sources said. The move has been interpreted as an effort to raise funds for investment, especially with the compan
TSMC was accused of making a site selection error in building a factory in the United States, and Arizona had serious problems with water shortages an
Aug 16, 2023
08-16
2023
On August 14, it was reported that TSMC's plan to establish a plant in the United States had encountered some difficulties and challenges, resulting in progress falling behind expectations. According to UDN, in this regard, Xu Jigao, an engineering doctor
Compound semiconductor becomes a key material, and Taiwan, China and Japan will cooperate to build an industrial chain
Aug 16, 2023
08-16
2023
According to a report by Taiwan Media Joint News Network, compound semiconductors have become a major trend in global development in recent years. Its high power, high frequency, and low power consumption characteristics have become key materials for impr
Huawei Flip Chip Packaging Patent Announced to Improve Heat Dissipation Performance
Aug 16, 2023
08-16
2023
A flip chip packaging patent of Huawei Technologies Co., Ltd. was published on the official website of the China National Intellectual Property Administration on August 15, with the number CN116601748A. The name of this patent is "Flip Chip Packaging with
Qualcomm is rumored to reduce the price of low-end 5G cell phone chips, the rate of reduction of about 10%-20%
Aug 15, 2023
08-15
2023
According to Taiwan's Economic Daily News reported that the cell phone market recovery is not as expected, the industry rumors, in order to stimulate customer willingness to pull goods and speed up the clearance of inventory, Qualcomm recently began a rou
Samsung buys Aixtron MOCVD equipment for GaN, SiC production
Aug 15, 2023
08-15
2023
Samsung Electronics and its domestic foundry counterparts DB Hitek and Key Foundry will purchase metal-organic chemical vapor deposition (MOCVD) equipment from Germany's Aixtron to enter the GaN (gallium nitride) and SiC (silicon carbide) chip manufacturi
Renesas Electronics announces $249 million acquisition of cellular IoT chip maker Sequans
Aug 15, 2023
08-15
2023
Japanese semiconductor maker Renesas Electronics has agreed to acquire French cellular IoT chip maker Sequans Electronics for $249 million in a deal that is expected to close in the first quarter of 2024, subject to formal approval by France's Commission
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