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Moderate recovery in demand, adding variables to the peak season effect of semiconductors in the second half of the year
May 17, 2023
05-17
2023
On May 15th, according to Taiwanese media reports, terminal demand was weaker than expected, and the adjustment period for the semiconductor industry was prolonged. TSMC and Liandian, the two major wafer foundries, simultaneously lowered their output esti
Samsung to Invest US$220 Million in Chip Production Line in Tokyo, Japan
May 16, 2023
05-16
2023
According to Japanese media reports, following TSMC's investment in a new wafer fab in Japan, South Korea's Samsung Electronics plans to invest 30 billion yen (about $220 million) to build a semiconductor back-end packaging and testing line in Yokohama, J
Infineon Introduces New Generation of Dual-Channel Isolated Gate Driver ICs to Enhance System Performance of SMPS Designs
May 16, 2023
05-16
2023
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has launched the next generation of its dual-channel electrically isolated EiceDRIVER™ gate driver IC product family.
DENSO and UMC's Japanese subsidiary achieve mass production shipment of 12-inch IGBT wafers
May 15, 2023
05-15
2023
DENSO Corporation, a Japanese automotive electronics supplier, and USJC, a Japanese subsidiary of foundry major UMC, held a mass production shipment ceremony for 12-inch IGBTs at USJC's fab in Mie Prefecture, Japan, on May 10. The two companies jointly an
Samsung and Naver to work together to build generative AI and AI chips
May 15, 2023
05-15
2023
According to Korea Economic News, two of South Korea's tech giants – Samsung Electronics and Naver - have reached a cooperation agreement to jointly develop a generative artificial intelligence platform for enterprise applications to compete with global A
Toshiba Launches New Digital Isolator
May 15, 2023
05-15
2023
Shanghai, China, May 9, 2023- Toshiba Electronics and Storage Co., Ltd. ("Toshiba") announced the launch of a new high-speed four channel digital isolator "DCL54xx01" series, which features 100kV/ μ High common mode transient suppression (CMTI) of s (mini
Arm is said to be heading to the United States for an IPO as early as September: the largest IPO of a chip company, with a maximum funding of $10 bill
May 13, 2023
05-13
2023
According to reports, people familiar with the matter said today that Arm, a chip design company of SoftBank Group, will go to the United States for an IPO (initial public offering) as early as September this year, with a maximum financing of US$10 billio
Samsung Electronics develops its first CXL DRAM with CXL 2.0 support
May 13, 2023
05-13
2023
Following the development of the first CXL DRAM (memory expander) based on CXL 1.1 in May 2022, Samsung Electronics continues to launch a 128GB CXL DRAM with CXL 2.0 support, which is expected to accelerate the commercialisation of next-generation storage
Hyundai Plans to Build a New Electric Car Plant in South Korea with an Investment of 2 Trillion KRW
May 13, 2023
05-13
2023
News reports suggest that Hyundai Motor Group will spend 2 trillion won to build a new factory in South Korea for the production of electric cars.
BYD Intelligent Driving R&D Coach Change, AI Chip Team Preparation
May 12, 2023
05-12
2023
In BYD's view, electrification is the first half and intelligence is the second half. The company has also mentioned many times that BYD's strategy attaches great importance to the development of intelligent driving, and will launch technologies and produ
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