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Teledyne e2v Released Optimom, a 1.5 Megapixel Turnkey Optical Module for Fast and Easy Vision System Development
Mar 06, 2023
03-06
2023
Teledyne e2v, a Teledyne Technologies group company, announced the release of Optimom 1.5M, the latest addition to the Optimom™ family, a new family of turnkey optical modules that can be integrated directly into vision systems.
Samsung's semiconductor business has lost 3 trillion won in January-February and is expected to lose 4 trillion won in the first quarter of this year,
Mar 04, 2023
03-04
2023
March 2, according to Korean media koreajoongangdaily report, from the semiconductor industry sources learned that Samsung semiconductor business in January-February this year has lost 3 trillion won (about 2.291 billion U.S. dollars), and the loss in the
NXP's New EdgeLock Security Chip Easily Provides Security to Enhance Matter Device User Experience
Mar 04, 2023
03-04
2023
NXP Semiconductors N.V. (NASDAQ: NXPI) announced the EdgeLock SE051H, a security chip designed specifically for Matter, further adding to the industry's broadest portfolio of Matter devices. The EdgeLock SE051H is a single-chip solution with NFC integrati
Masayoshi Son decides to let Arm list in New York within the year
Mar 03, 2023
03-03
2023
SoftBank Group's British chip design giant ARM has decided not to issue shares on the London Stock Exchange for the time being, in a blow to British politicians. This comes after British politicians had been lobbying for ARM to list on their home exchange
Vishay Introduces Upgraded Infrared Receivers to Reduce Supply Current and Improve Reliability Against ESD and Direct Sunlight
Mar 03, 2023
03-03
2023
Vishay Intertechnology, Inc(NYSE: VSH) announced today that it has upgraded its TSOP2xxx, TSOP4xxx, TSOP57xxx, TSOP6xxx and TSOP77xxx series of infrared (IR) receiver modules for infrared remote control applications with the next-generation Cyllene 2 IC.
Samsung Electro-Mechanics develops FCBGA semiconductor substrate for autonomous driving
Mar 02, 2023
03-02
2023
Samsung Electro-Mechanics has announced that it has developed an automotive semiconductor substrate (FCBGA, Flip Chip-Ball Grid Array) for advanced driver assistance systems (ADAS), expanding its lineup of high-end automotive semiconductor substrates, whi
The Global Mobile Communications Equipment Giant will Lay off 8,500 Employees
Mar 02, 2023
03-02
2023
Swedish telecom equipment maker Ericsson recently announced "global job cuts". The company will cut 8,500 jobs worldwide in stages, equivalent to 8 percent of its global workforce, with the aim of "cutting costs. Ericsson said that most of the job cuts wi
Qualcomm CEO: Apple will abandon Qualcomm in 2024 and use self-developed 5G baseband chips
Mar 02, 2023
03-02
2023
It was previously reported that because Apple's first 5G baseband chip has not made a breakthrough in research and development, Qualcomm will become the only 5G modem supplier for the iPhone 15 series. This means Qualcomm can continue to get a steady reve
Western Digital Helps Consumers Address Surge in Data Storage Needs with Milestone Storage Capacity Upgrade
Mar 01, 2023
03-01
2023
Feb. 22 - Western Digital Corporation (NASDAQ: WDC) today announced that its Western Digital™ (WD™) brand is expanding its popular My Book™ line of desktop hard drives to help consumers meet the growing demand for data storage. In keeping with its commitm
Samsung launches Exynos 1380/1330 chip: 5nm process, supports up to 200 million pixels
Feb 28, 2023
02-28
2023
Samsung has launched two processors, the Exynos 1380 and Exynos 1330, both of which support 5G.Among them, the Exynos 1380 adopts a 5nm process and has four ARM Cortex-A78 CPU cores with a frequency of 2.4GHz and four ARM Cortex-A55 CPU cores with a frequ
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