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South Korea's LS Eco Energy signs large-scale rare earth supply agreement with Vietnamese company

South Korea's LS Eco Energy signs large-scale rare earth supply agreement with Vietnamese company

Jan 22, 2024

01-222024

LS Eco Energy (formerly known as LS Cable & System Asia) has become the first South Korean company to sign a large-scale, long-term rare-earth sourcing contract in Vietnam, which is expected to stabilize its rare-earth supply chain by diversifying its sou
Japan's DISCO develops new wafer dicing machine that cuts silicon carbide 10 times faster

Japan's DISCO develops new wafer dicing machine that cuts silicon carbide 10 times faster

Jan 20, 2024

01-202024

Japanese wafer equipment manufacturer DISCO launched a new SiC (silicon carbide) dicing machine in December 2023, which can increase the dicing speed of silicon carbide wafers by 10 times, and the first batch of products has been delivered to customers. S
Infineon and Aurora Labs Deliver Optimized Predictive Maintenance Solutions for the Automotive Industry to Enhance Driving Safety to a Whole New Level

Infineon and Aurora Labs Deliver Optimized Predictive Maintenance Solutions for the Automotive Industry to Enhance Driving Safety to a Whole New Level

Jan 20, 2024

01-202024

Infineon Technologies AG and Aurora Labs (Aurora Labs) are unveiling a new set of Artificial Intelligence (AI) solutions at CES 2024 to improve the long-term reliability and safety of critical automotive components such as steering, braking, airbags and m
After ST, Li Auto signs another SiC supply agreement with ON again

After ST, Li Auto signs another SiC supply agreement with ON again

Jan 19, 2024

01-192024

On Jan. 9, ON Semiconductor announced that it has renewed its long-term supply agreement with Li Auto. Li Auto uses ON's proven 8 megapixel image sensors in its Extended Range Electric Vehicle (EREV) models. With this agreement, RISO will utilize ON's hig
Texas Instruments Debuts New Automotive Chips at CES 2024

Texas Instruments Debuts New Automotive Chips at CES 2024

Jan 19, 2024

01-192024

Jan. 9, 2024 -- Texas Instruments Incorporated (TI) (NASDAQ: TXN) today unveiled new semiconductors designed to improve automotive safety and intelligence.The AWR2544 77GHz millimeter-wave radar sensor chip, designed with a satellite radar architecture, e
Hisense First to Adopt MediaTek's Pentonic Smart TV Chip

Hisense First to Adopt MediaTek's Pentonic Smart TV Chip

Jan 18, 2024

01-182024

January 12, 2012 - MediaTek announced that it will further deepen its long-term partnership with Hisense. Hisense is the first to adopt MediaTek's Pentonic smart TV chip, which significantly improves the picture quality of streaming content. Starting in 2
Renesas' $339 Million Acquisition of GaN Company Transphorm has Reached a Definitive Agreement

Renesas' $339 Million Acquisition of GaN Company Transphorm has Reached a Definitive Agreement

Jan 18, 2024

01-182024

Pursuant to the agreement, the Renesas subsidiary will acquire all of the outstanding shares of common stock of Transphorm for $5.10 per share in cash, which represents a premium of approximately 35% to Transphorm's closing price on January 10, 2024, a pr
ONSEMI and Li Auto Renew Long-Term Supply Agreement to Utilize EliteSiC 1200V Bare Chip for Next-Generation 800V Pure Electric Vehicles

ONSEMI and Li Auto Renew Long-Term Supply Agreement to Utilize EliteSiC 1200V Bare Chip for Next-Generation 800V Pure Electric Vehicles

Jan 17, 2024

01-172024

ONSEMI (NASDAQ: ON), a leader in intelligent power and intelligent sensing technologies, announced that it has renewed its long-term supply agreement with Li Auto, a luxury smart electric vehicle brand. Li Auto will utilize ON's proven 8-megapixel image s
TSMC continues to expand CoWoS packaging capacity

TSMC continues to expand CoWoS packaging capacity

Jan 17, 2024

01-172024

According to industry sources, TSMC continues to expand its CoWoS packaging capacity despite recent market rumors that NVIDIA has scaled back orders with TSMC foundries for 2024.
GUC Officially Ships UCIe 32G IP Based on TSMC 3nm and CoWoS Technology

GUC Officially Ships UCIe 32G IP Based on TSMC 3nm and CoWoS Technology

Jan 16, 2024

01-162024

Global Unichip Corp.（GUC）, a leading supplier of advanced special application ICs (ASICs), today announced that it has successfully prototyped 32Gbps-per-channel Universal Chiplet Interconnect Express™ (UCIe™) physical layer IP, the fastest UCIe available
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